AG Liquid Adhesive Thermopaste for Remote Control, 14.8g, Set of 100 Buttons ART.AGT-021

The product is a two-component liquid encapsulation compound, thermally conductive. Curing occurs at room temperature.

The material offers thermal conductivity and low expansion. Ideal for encapsulating or filling gaps in electronic components

that generate heat, with metal housings or heat sinks. It has excellent fluidity for dosing and encapsulation.

After curing, it does not detach due to cyclic heating from the surface to which it adheres. The cured product is dry to the touch.