Amaoe U-IP12 BGA Stencil for Apple iPhone 16 Series, CPU / Baseband / IC

The Amaoe U-IP12 BGA stencil is specially designed for high-precision repairs on the Apple iPhone 16 series, offering an efficient and durable solution

for chip reballing. With an ultra-thin 0.12mm design, it fits perfectly on the surface of ICs, significantly increasing the success rate

and ensuring optimal performance in repair processes. Made from high-quality stainless steel, the stencil excellently resists high temperatures

and corrosion, maintaining its shape without deformation even after prolonged use. Micron-level laser cutting technology guarantees

uniform hole precision, reducing the risk of misalignment, solder bridges, or soldering defects. Perfectly compatible with CPUs,

basebands, power management ICs, and other chips frequently used in repairs, the Amaoe U-IP12 stencil is ideal

for both individual technicians and professional workshops or mass production.

- Ultra-thin 0.12mm design for precise fit and increased reballing success

- Material: heat and corrosion-resistant stainless steel

- High-precision laser technology for uniform solder ball alignment

- Compatible with CPU, baseband, power IC, and other Apple iPhone 16 chips

- Fast and easy operation, increased efficiency, and low defect rate

- High wear resistance, easy to clean, and reusable hundreds of times

- Cost-effective, significantly reducing repair expenses