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BGA Reballing Stencil RL-044 V2.0 for Xiaomi Series CPU
BGA Stencil Relife RL-044 V2.0
for Xiaomi Series CPU
The BGA Stencil Relife RL-044 V2.0 is a high-precision tool specially designed for reballing operations of processors from the Xiaomi and Redmi range.
Made from superior quality steel, it features an innovative design with round and square holes, as well as a half-cut system
that allows perfect alignment and prevents excessive solder accumulation. Each stencil has been rigorously calibrated according to the original drawings
and tested on real components to ensure that no soldering point is missed. This ensures an even application of solder paste
and proper formation of solder balls, providing technicians with a fast and efficient method to refurbish
complex integrated circuits without compromising the integrity of the motherboard.
Features:
- Compatibility: Models from Xiaomi and Redmi series
- Material: High-quality steel, resistant to thermal deformation
$16.04
Original: $45.84
-65%BGA Reballing Stencil RL-044 V2.0 for Xiaomi Series CPU—
$45.84
$16.04Product Information
Product Information
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Shipping & Returns
Description
BGA Stencil Relife RL-044 V2.0
for Xiaomi Series CPU
The BGA Stencil Relife RL-044 V2.0 is a high-precision tool specially designed for reballing operations of processors from the Xiaomi and Redmi range.
Made from superior quality steel, it features an innovative design with round and square holes, as well as a half-cut system
that allows perfect alignment and prevents excessive solder accumulation. Each stencil has been rigorously calibrated according to the original drawings
and tested on real components to ensure that no soldering point is missed. This ensures an even application of solder paste
and proper formation of solder balls, providing technicians with a fast and efficient method to refurbish
complex integrated circuits without compromising the integrity of the motherboard.
Features:
- Compatibility: Models from Xiaomi and Redmi series
- Material: High-quality steel, resistant to thermal deformation
