BGA Stencil Relife RL-044 for Android CPU

The Relife RL-044 BGA Stencil for Android CPU is a professional set of templates for solder ball placement, designed for advanced repairs

at the motherboard level. It is intended for interventions on chips in Android devices and offers extensive compatibility with a wide range of processors

and circuits used in GSM repair services. The set supports series such as Qualcomm Snapdragon, Dimensity, Hisilicon Kirin, Exynos, BGA, and other Android platforms,

and is also compatible with the ACU, EMMC, EXC, HIC, MTC, and SMC series. Each stencil is calibrated based on actual dimensions and specific technical drawings,

to ensure precise positioning of soldering points and correct application of solder.

The special design for mobile phone chips includes precise round and square holes, made to obtain uniform and well-defined solder balls,

compliant with the requirements of different types of chips. The ultra-thin construction allows for a better fit during the placement process,

and the material offers high flexibility, resistance to repeated bending, and durability in use.

The Relife RL-044 set is an excellent choice for technicians who need precision,

extensive compatibility, and efficiency in rebaling and professional repair work.

- Model: RL-044

- Size: 50 x 50 mm

- Thickness: 0.12 / 0.15 mm

- Net weight: approximately 130 g

- Quantity: 58 pieces / set

- 4 x ACU

- 6 x EMMC

- 9 x HIC

- 11 x MTC

- 21 x SMC

- 7 x EXC