Mechanic XGSP50 Solder Paste, Melting Point 183 Degrees

Mechanic XGSP50 solder paste is a high-quality professional solution, designed for specialists in microelectronics, GSM repairs

and technical workshops working with SMD components. With a melting point of 183 degrees C, this low-temperature paste is

ideal for interventions on sensitive circuits or rework operations that require precise thermal control. Its balanced formula

ensures excellent wetting, optimal conductivity, and high thermal stability. It offers perfect adherence to pads and

components, ensuring clean, durable solder joints with minimal residues. The packaging in a 42 g container makes it suitable

for use in small workshops or in small batch production.

- Melting point: 183 degrees C

- Composition: Sn63/Pb37 alloy

- Viscosity: suitable for manual or automatic soldering

- Use: rework, SMD soldering, BGA, QFN, LED, etc.

- Application: compatible with syringe, spatula, or stencil

- Conductivity: high

- Residues: low level after soldering

- Storage: in a cool place (0 degrees - 10 degrees C recommended)