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QIANLI QS25 BGA Template for Apple iPhone Series, CPU1
QIANLI QS25 BGA Stencil for Apple iPhone Series
The QIANLI Bumblebee QS25 stencil is specially designed for reballing Apple iPhone processors, offering high precision and perfect alignment
of solder balls on the CPU. Made from premium materials, this stencil is durable, stable, and long-lasting even with frequent use in professional repair shops.
BGA-type cutouts with square holes and rounded corners ensure stable fixation and even distribution of the balls, minimizing errors and improving the efficiency
of the rework process. Thanks to the improved surface treatment and new materials, solder paste application is smoother and cleaning is easier.
Features:
- Brand: Qianli Bumblebee, model QS25
- Compatible with Apple iPhone series (CPU reballing)
- Square cutouts with rounded corners for precise alignment
- Robust material, resistant to temperatures and repeated use
- Optimized surface treatment for uniform solder paste application
- Ideal for reballing and restoring BGA solder joints on Apple CPUs
$1.92
Original: $5.50
-65%QIANLI QS25 BGA Template for Apple iPhone Series, CPU1—
$5.50
$1.92Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
QIANLI QS25 BGA Stencil for Apple iPhone Series
The QIANLI Bumblebee QS25 stencil is specially designed for reballing Apple iPhone processors, offering high precision and perfect alignment
of solder balls on the CPU. Made from premium materials, this stencil is durable, stable, and long-lasting even with frequent use in professional repair shops.
BGA-type cutouts with square holes and rounded corners ensure stable fixation and even distribution of the balls, minimizing errors and improving the efficiency
of the rework process. Thanks to the improved surface treatment and new materials, solder paste application is smoother and cleaning is easier.
Features:
- Brand: Qianli Bumblebee, model QS25
- Compatible with Apple iPhone series (CPU reballing)
- Square cutouts with rounded corners for precise alignment
- Robust material, resistant to temperatures and repeated use
- Optimized surface treatment for uniform solder paste application
- Ideal for reballing and restoring BGA solder joints on Apple CPUs
